# Direct immersion cooling

This MIT Technology Review Insights conversation produced in partnership with Syensqo records the views of Mike Finelli, Syensqo's chief technology and innovation officer and chief North America officer: AI is pushing semiconductors and data centers toward physical limits, which piles up more simultaneous requirements on advanced materials, and Syensqo is responding by developing materials for high-voltage data center architectures, advanced sealing materials for semiconductor manufacturing, and thermal-management solutions including direct immersion cooling fluids, while working with Microsoft on AI agents that digitally synthesize millions of candidate molecules, predict their performance through physics-based simulation, and rank them down to roughly a hundred candidates for laboratory

This MIT Technology Review Insights conversation produced in partnership with Syensqo records the views of Mike Finelli, Syensqo's chief technology and innovation officer and chief North America officer: AI is pushing semiconductors and data centers toward physical limits, which piles up more simultaneous requirements on advanced materials, and Syensqo is responding by developing materials for high-voltage data center architectures, advanced sealing materials for semiconductor manufacturing, and thermal-management solutions including direct immersion cooling fluids, while working with Microsoft on AI agents that digitally synthesize millions of candidate molecules, predict their performance through physics-based simulation, and rank them down to roughly a hundred candidates for laboratory