Building the materials foundation for AI: Syensqo on advanced materials and AI as a two-way driver
This MIT Technology Review Insights conversation produced in partnership with Syensqo records the views of Mike Finelli, Syensqo's chief technology and innovation officer and chief North America officer: AI is pushing semiconductors and data centers toward physical limits, which piles up more simultaneous requirements on advanced materials, and Syensqo is responding by developing materials for high-voltage data center architectures, advanced sealing materials for semiconductor manufacturing, and thermal-management solutions including direct immersion cooling fluids, while working with Microsoft on AI agents that digitally synthesize millions of candidate molecules, predict their performance through physics-based simulation, and rank them down to roughly a hundred candidates for laboratory