Printed PLA gets a causal chain from clay exfoliation to layer bonding and voids, reaching 62.5 MPa at 2 wt.% clay
Strength in fused-filament PLA parts modified with organo-modified montmorillonite depends jointly on clay exfoliation, melt rheology, interlayer thermal bonding and pore morphology, while earlier optimization mapped filler fraction and print parameters directly to mechanical properties. C³M-OMMT Twin chains clay exfoliation and rheology state, layer-by-layer thermal history, defect-interface graphs, causal mechanical response, Bayesian Pareto optimization and experimental validation. Across 0 to 5 wt.% clay and nozzle temperatures from 195 to 225 °C, its optimum is about 2 wt.% clay, 215 °C, 0.15 mm layer height and 35 mm/s, giving 62.5 MPa tensile strength, 94.1 MPa flexural strength and 2.18% void fraction.